Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window

ABSTRACT

An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

CROSS-REFERENCE TO RELATED APPLICATION

[0001] The present application claims priority of U.S. provisionalapplication, Ser. No. 60/349,737, filed Jan. 17, 2002 by Johnson forMETHOD OF MOUNTING ELECTRICAL CONNECTOR TO VEHICLE WINDOW (AttorneyDocket DON02 P-961), which is hereby incorporated herein by reference.

FIELD OF THE INVENTION

[0002] The present invention relates generally to vehicle windows and,more particularly, to vehicle windows having electrical elements, suchas defroster elements or antenna elements, at a surface of a glass sheetof the window, and a method and apparatus for attaching such electricalelements to the glass sheet.

BACKGROUND OF THE INVENTION

[0003] Many windows for vehicles, such as rear windows or windshields orthe like, include electrical components or conductive elements, such asdefrosting heater elements, such as defroster lines, strips or coils, orantenna elements or the like at or along a surface of a glass sheet ofthe window. Such conductive elements typically comprise electricallyconductive silver flakes, which are mixed with low melting glass andapplied or screened as a thick film to a surface of the glass sheet forthe window or to a ceramic frit layer on the surface of the glass sheet.The silver layer is typically applied when the glass sheet has been cutto its desired shape and/or when a ceramic frit layer has been appliedor screened to portions of the glass sheet. The glass sheet, whichincludes the defroster strips and conductive elements, is typicallyheated in a furnace to heat the glass to its melting point and to meltand fuse the silver conductive flakes and ceramic frit. The heated glasssheet is then molded to its desired shape and quickly cooled or temperedto achieve the tempered glass for the window. Typically, this isperformed at a window or glass sheet manufacturing plant or fabricationplant.

[0004] Typically, after the glass sheet is formed, a number of suchglass sheets are packaged and moved to another area of the glassmanufacturing plant to have an electrical connector or clip attached tothe silver conductive element. Typically, the connector is soldered tothe conductive layer that is on a surface of the glass sheet at the endof the conductive line or strip. This is accomplished by various knownsoldering approaches, such as induction heating, contact heating orresistance heating, whereby the solder on the clip is heated to melt thesolder and then cooled to secure the solder and the clip to the silverlayer and frit layer on the glass sheet. Such known methods of solderingthe connector to the conductive layer or element typically are capitalintensive and may require costly equipment and/or typically providechallenges or difficulties in process control.

[0005] After the connector or tab is attached to the conductive elementon the surface of the glass sheet, the glass sheet is not as well suitedfor dense packaging as it was before attachment of the connector.Therefore, the glass sheets are typically repacked in a less densemanner after attachment of the connectors and are then shipped to avehicular or modular window assembly or manufacturing line, typically ata different assembly plant or facility, for further processing, whichmay include adding hinges, seals, frames or the like to the glass sheetto complete the modular window assembly. Such a conventional process isshown generally in FIG. 1.

[0006] Because of the costs and challenges associated with such knownmethods of attaching the electrical connectors, and because of the timeinvolved in heating and cooling the connector, solder layer and glasssheet during such attachment processes, such approaches are typicallyperformed at the glass sheet fabrication plant and are not suited forapplication at the modular window assembly plant. Therefore, the glasssheet of a vehicle window currently is typically packaged two timeswithin the glass sheet fabrication or manufacturing plant, such that thecurrent process is inefficient and, thus, may add to the cost of thecompleted window assembly. Also, because the electrical connector istypically mounted or secured to the glass sheet at the glassmanufacturing plant, the glass sheets may be packaged in a less densemanner when transported to the vehicular or modular window assemblyplant, which is typically remote from the glass manufacturing plant.

[0007] Therefore, there is a need in the art for a window manufacturingand assembling process that overcomes the shortcomings of the prior artprocesses.

SUMMARY OF THE INVENTION

[0008] The present invention is intended to provide an apparatus andmethod for attaching an electrical connector to a conductive element,such as a silver conductive layer, such as an antenna element ordefrosting heating element, of a glass sheet of a vehicular or modularwindow assembly. The connector may be soldered to the conductive elementor bus bar of the glass sheet, which may comprise a tempered glass sheetor other type of glass sheets, such as an annealed glass sheet, alaminated glass sheet or the like, and may comprise a tinted or untintedglass sheet and/or may include solar coatings or the like, by heatingthe solder joint via substantially infrared radiation heating. Themethod is preferably performed at a vehicular or modular window assemblyline or plant or facility, where a frame and/or hinge and/or othercomponents may be assembled or applied to the glass sheet portion of themodular window assembly.

[0009] According to an aspect of the present invention, an electricalconnector is applied to a conductive element, which is deposited ordisposed on a surface of a glass sheet of a window and exposed at aterminal end of an electrical element, via radiation heating of theconnector or a solder layer at the connector with an infrared radiativeheating device. The conductive element may be a silver conductive layeror line, such as an antenna element or defroster heater element or thelike. The heating device preferably comprises an infrared lamp and areflector, which functions to focus or channel or funnel or otherwisedirect the radiant energy from the lamp selectively to the region of thesolder joint to be established, while minimizing radiant heating ofperipheral and adjacent regions of the glass sheet or panel. Theinfrared lamp is operable to generate infrared radiant energy, whichpreferably is in the short wavelength or far infrared region, such asaround 800-1500 nm, more preferably approximately 1000-1300 nm, and mostpreferably approximately 1100-1200 nm, at a target or focal regiongenerally corresponding with the location of a solder layer or the likebetween the electrical connector and the conductive element. Theconnector preferably includes a layer of solder or other suitablematerial deposited on or integral with the surface of the connector tobe connected to the conductive element, such that when the solder and/orconnector are heated to a desired temperature, the solder melts and thencools and refreezes to bond or adhere to the conductive element on theglass sheet or window surface.

[0010] According to another aspect of the present invention, a methodfor applying an electrical connector to a conductive element disposed ona surface of a glass sheet of a window comprises providing a glass sheethaving a conductive element disposed on a surface thereof. Asubstantially infrared radiative heating device is provided whichcomprises an infrared lamp and a reflector configured to focus or funnelor otherwise direct radiant energy from the lamp at a target or focalregion. An electrical connector is positioned at the conductive elementof the glass sheet, and the heating device is positioned relative to theglass sheet such that the target or focal region corresponds generallywith the solder joint or solder layer between the electrical connectorand the conductive element of the glass sheet. The electrical connectoris attached to the conductive element via radiation heating of thesolder layer with the infrared radiative heating device.

[0011] The electrical connector may be applied to the conductive elementvia radiation heating of a layer of solder at a surface of theelectrical connector to be connected to the conductive element, suchthat when the solder and the electrical connector are heated to adesired temperature, the solder melts and then cools and refreezes tobond or adhere to the conductive element on the window surface.

[0012] The heating device may comprise a shaped reflector, such as aparabolic-shaped reflector or an ellipsoid-shaped reflector or anozzle-shaped reflector or the like, which is shaped or configured todirect radiant energy from the lamp at a target or focal region. Theshaped reflector may comprise a truncated ellipsoidal reflector definingfirst and second focal points. The infrared lamp may be positionedgenerally at the first focal point and the target or focal region may begenerally at the second focal point.

[0013] The radiative heating device may rapidly and substantially heatthe solder layer, while substantially limiting or substantially avoidingdirecting radiant heating energy to the glass sheet. The heating devicemay include a shield or holding device which temporarily holds theelectrical connector at the glass sheet during the radiation heatingprocess and substantially limits directing of heat toward and to theglass sheet and/or substantially limits dissipation of heat into theglass sheet by shielding the glass sheet from the energy generated bythe radiative heating device.

[0014] The electrical connector may be positioned at a first surface ofthe glass sheet, while the heating device is positioned at a secondsurface of the glass sheet which is opposite the first surface. Theheating device may be operable to radiate energy through the glass sheetto the target or focal region at the first surface of the glass sheet.The target region and solder layer at the electrical connector may thusbe heated by the heating device, while the glass sheet and surroundingarea are not substantially heated.

[0015] The glass sheet may be manufactured or fabricated at a glass orwindow manufacturing or fabrication plant or facility and then may betransported to a vehicular or modular window assembly plant or facilityremote from the glass manufacturing plant. The electrical connector maybe attached to the conductive element of the glass sheet at the modularwindow assembly plant.

[0016] According to another aspect of the present invention, anattachment system for attaching or soldering an electrical connector toa glass sheet comprises a heating device and a holding device. Theheating device comprises an infrared radiative heat source positioned atleast partially within a shaped reflector. The shaped reflector isshaped or configured to focus or channel or funnel or otherwise directinfrared radiant energy from the lamp at a target region. The holdingdevice is configured to temporarily hold the electrical connector duringthe heating process. The heating device and the holding device arearrangable relative to one another and relative to the glass sheet suchthat the holding device and the electrical connector are positionablegenerally at a surface of the glass sheet and the heating device ispositionable generally at the holding device with a solder layer beinggenerally at the target region. The heating device is operable togenerate and direct the energy at the target region to heat and melt thesolder layer while the holding device holds the electrical connector andsubstantially limits directing of the energy to the glass sheet.

[0017] The shaped reflector may comprise a parabolic-shaped reflector,an ellipsoid-shaped reflector and a nozzle-shaped reflector. The shapedreflector preferably comprises a polished metallic interior surface forreflecting and directing the energy at the target region.

[0018] The holding device generally surrounds the electrical connectorand substantially limits directing of the infrared radiant energy to theglass sheet, such as around the electrical connector to the glass sheet,during the heating process. The holding device may comprise a baseportion and a pivotable portion which is pivotable relative to the baseportion to release the electrical connector as the holding device ismoved from the electrical connector and the glass sheet.

[0019] Therefore, the radiation heating device and process and system ofthe present invention provides for rapid heating of a layer of solder ata window element or electrical connector at a glass sheet, whilesubstantially limiting directing of the heat to the glass sheet.Therefore, the soldering process may be completed in a short period oftime without substantially heating the glass sheet, such that theattachment of the window element to the glass sheet may be performed ata modular window assembly plant, which typically attaches a frame, sealand/or hinge or the like to the glass sheet. Also, because the radiationheating process of the present invention requires less capitalinvestment than known induction heating processes, the radiation heatingprocess may be performed by the final modular window assembler ormanufacturer. The glass sheet window portions thus may be denselypackaged a single time by the glass sheet manufacturer or at the glassmanufacturing plant or glass fabrication plant (which cuts, shapes andtempers the glass and applies the frit layer and electrical orconductive layers or lines to the glass sheet) and then shipped to thevehicular or modular window assembly plant, which then may add the frameportions, seals, hinges and/or the like and the electrical connectors tothe glass sheet portions. The completed vehicular or modular windowassemblies are then shipped to the automotive manufacturer's assemblyplant for installation on vehicles. Because the window elements, such aselectrical connectors and/or the like, are applied or attached orsoldered to the conductive elements on the glass sheets at the modularwindow assembly plant, the glass sheets may be densely packaged forshipment to the modular window assembly plant, and may be only packedand unpacked one time, thereby providing a lower cost manufacturingprocess for vehicle modular window assemblies.

[0020] These and other objects, advantages, purposes and features of thepresent invention will become apparent upon review of the followingspecification in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0021]FIG. 1 is a process diagram of the conventional steps involved inmanufacturing and assembling a window assembly;

[0022]FIG. 2 is a sectional view of a heating device in accordance withthe present invention, as positioned at an electrical connector to besoldered to a conductive element on a glass sheet;

[0023]FIG. 3 is a top plan view of an electrical connector suitable forsoldering to a conductive element on a window surface;

[0024]FIG. 4 is a side elevation of the electrical connector of FIG. 3;

[0025]FIG. 5 is a sectional view of another heating device in accordancewith the present invention;

[0026]FIG. 6 is a perspective view of another heating device inaccordance with the present invention;

[0027]FIG. 7 is an upper perspective view of a holding device usefulwith the heating device of the present invention;

[0028]FIG. 8 is a lower perspective view of the holding device of FIG.7;

[0029] FIGS. 9-11 are side elevations and partial sectional views of theheating and cooling and retracting processes for attaching an element toa glass sheet in accordance with the present invention; and

[0030]FIG. 12 is a process diagram in accordance with the presentinvention of the steps involved in manufacturing and assembling amodular window assembly, with the electrical connectors being attachedor soldered to the glass sheets at a vehicular or modular windowassembly plant.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Referring now specifically to the drawings and the illustrativeembodiments depicted therein, an infrared radiation heating device 10 ispositionable at or near a glass sheet 12, such as a tempered glass sheetor an annealed glass sheet or a laminated glass sheet or panel or thelike, and operable to heat a layer of solder 26 or the like at anelectrical connector or clip 14 to attach or solder the connector 14 toa conductor or conductive element 24 a of an electrical component oraccessory 24 on the glass sheet 12 (FIG. 2). Heating device 10 includesan infrared lamp 16 and a reflector or reflective shield 1 8, whichfunctions to direct or focus or channel or funnel the radiant energygenerated from lamp 16 to a target location or focal region 18 b, suchthat the heat source or lamp does not contact the target area orlocation or connector during the heating process. The electricalconnector and glass sheet are positioned relative to the heating device10 such that the solder layer at the electrical connector 14 isgenerally at the focal region 18 b. The solder layer 26 is heated by theinfrared radiative heating device 10 and melts, whereby the heatingdevice 10 is deactivated or moved away from the electrical connector andsolder layer to allow the solder layer to cool and refreeze and thusbond or adhere the electrical connector to the conductive element of theglass sheet. The electrical connector 14 may be temporarily held orsecured in place during the heating and cooling processes to maintainthe connector in the appropriate position at the glass sheet until thesolder layer has cooled and hardened and bonded or adhered the connectorto the conductive element on the glass sheet.

[0032] Glass sheet 12 comprises a sheet formed for a vehicle window, andpreferably comprises tempered glass, but may comprise an annealed glasssheet or a laminated glass sheet or the like, without affecting thescope of the present invention. A ceramic frit layer 22 is preferablyformed or disposed partially on a surface 12 a of the glass sheet 12(which may be the interior surface of the window after the modularwindow assembly is completed and installed on a vehicle). The glasssheet 12 may comprise a tinted or untinted glass sheet or panel and/ormay include solar coatings or the like, without affecting the scope ofthe present invention. Glass sheet 12 includes electrical component oraccessory 24, such as an antenna or defroster or the like, whichcomprises conductive layer or element 24 a, such as a silver conductivelayer, line or bus bar or the like, formed on or applied to the windowsurface 12 a, such as on ceramic frit layer 22 at an end of a conductoror conductive line or strip. Electrical connector 14 may be attached toan end of the conductive element 24 a by heating a solder layer 26 onconnector 14 with heating device 10 to solder connector 14 to conductiveelement 24 a. Although shown and described as attaching an electricalconnector to a conductive layer, the heating device and method of thepresent invention may be equally suitable for use in fastening orattaching or securing other components or hardware or window elements,such as window hardware, clips, studs, antennae and/or the like, to aglass sheet of an automotive window.

[0033] Connector 14 may comprise an electrical connector for connectingto an electrical wiring of the vehicle, such as a connector or clip orterminal of the type commercially available from Antaya TechnologiesCorp. of Cranston, R.I. As shown in FIGS. 2-4, connector 14 includes abase portion 14 a and a connector portion 14 b extending outward frombase portion 14 a. Connector portion 14 b is adapted to connect to acorresponding connector of a vehicle (not shown) when the modular windowassembly is installed to the vehicle. Base portion 14 a preferablyincludes a plurality of dimples or protrusions 14 c extending from thelower or contact surface of base portion 14 a. The layer of solder 26may be applied to or disposed at the contact surface of base portion 14a for securing the base portion 14 a to the conductive element of theglass sheet. Optionally, the connector 14 may be substantially dipped insolder or the like or coated with a solder layer, without affecting thescope of the present invention. The protrusions 14 c function to provideand maintain an appropriate space or gap between base portion 14 a andthe conductive element 24 a on the window surface 12 a to enhance theeffectiveness of the solder 26 at the conductive element 24 a.

[0034] Heating device 10 comprises a radiation heating device whichradiates energy to a target or focal region. Heating device 10 maycomprise a known radiation or infrared heater, such as the typecommercially available from Research, Inc. of Eden Prairie, Minn.Infrared lamp 16 preferably comprises a high intensity, quartz infraredlamp or heat source and is positioned within reflector 18. Infrared lamp16 may comprise a tubular quartz, short wave infrared lamp or maycomprise a long wave infrared lamp, depending on the application of theheating device. Optionally, infrared lamp or radiative source 16 maycomprise an EVD 36 volt, 400 watt lamp commercially available from WikoLtd. of Orland Park, Ill., without affecting the scope of the presentinvention. Preferably, at least some, and more preferably a considerableportion, of the energy radiated from the selected lamp or radiativesource is at or within the near-infrared or infrared region of theenergy spectrum, such as approximately 800-1500 nm, more preferablyapproximately 1000-1300 nm, and most preferably approximately 1100-1200nm. It is further envisioned that two or more infrared lamps may beimplemented within reflector 18, depending on the application, withoutaffecting the scope of the present invention.

[0035] As best shown in FIGS. 2 and 5, reflector 18 may comprise ashaped reflector, such as a parabolic reflector or an elliptical shapedreflector or shield which defines a pair of focal regions 18 a, 18 bnear opposite ends of the reflector 18. Reflector 18 may comprise anellipsoidal reflector with an inner surface 18 c polished to a specularor mirrored finish. Reflector 18 may comprise a metallic material, suchas aluminum or the like, and is preferably truncated at one end suchthat the second focal region 18 b is positioned outside of the truncatedend of the reflector. Reflector 18 may comprise a two piece reflector,with one piece being truncated, or reflector 18 may comprise a singlepiece elliptical reflector or housing, preferably truncated at one endthereof, without affecting the scope of the present invention. Reflector18 may further include a flange portion 18 d extending radially outwardfrom reflector 18, such as at the joining region of the two pieces, formounting heating device 10 to a movable arm (not shown) or the like atthe modular window assembly line. Other means for mounting orpositioning heating device 10 at a support structure may be implemented,without affecting the scope of the present invention.

[0036] As best shown in FIG. 5, lamp 16 is positioned at one of twofocal regions 18 a of reflector 18. Because reflector 18 is shown as anelliptical-shaped reflector, the energy generated and radiated frominfrared lamp 16 at focal region 18 a will be directed or focused ortargeted to maximize the energy, and thus generate heat, at the otherfocal region 18 b, without significantly heating other areas surroundingthe focal region 18 b. The heating device 10 suitable for use in thepresent invention thus provides localized heat only to a desired areaand the heat source or lamp does not come in contact with the connector14 or the glass sheet 12. In the illustrated embodiment of FIG. 5,heating device 10 is operable to generate a temperature of greater thanapproximately 500 degrees F., and may generate a temperature ofapproximately 1000-2000 degrees F. or greater, within a short period oftime at focal region 18 b. The temperatures and energy or heat ratesachieved may vary depending on the shape of reflector 18, the type oflamp 16 and the size and material of the connector 14, without affectingthe scope of the present invention. The energy output of the heatingdevice may be adjusted to match the process requirements.

[0037] Preferably, heating device 10 is mounted to a movable orpivotable arm or support structure or the like (not shown) which ismovable to temporarily position heating device 10 at an appropriatelocation at or above a window assembly line, such that focal region 18 bgenerally corresponds with the solder layer 26 of electrical connector14, as connector 14 is positioned at the conductive element 24 a of aglass sheet 12 at or near heating device 10. The heating device 10 maythen be moved away from connector 14 and glass sheet 12 after the solderhas melted, in order to allow the solder to cool and refreeze to securethe connector to the conductive element 24 a of the glass sheet 12. Thesoldered connector and glass sheet may be removed (or moved along theassembly line or the like) and a new glass sheet and correspondingelectrical connector may then be provided at the heating device and theprocess may be repeated.

[0038] Optionally, the heating device 10 may be positionable at anopposite side 12 b of the glass sheet 12 to provide energy and heat tothe solder 26 and electrical connector 14 from the other side of theglass sheet, without affecting the scope of the present invention. Inthis regard, it is preferable to utilize short wavelength infraredradiation, such as infrared radiation having a wavelength of less thanapproximately 1000 nm, that is substantially transmitted by the glasssubstrate, but that is significantly absorbed by (and thus causesheating of) the black out ceramic frit layer or the silver layer or busbar or solder layer, thereby heating the solder at the electricalconnector. Suitable short wave radiation applications or methods aredisclosed in U.S. Pat. Nos. 6,203,639 and 6,054,001, which are herebyincorporated herein by reference. Because the energy is targeted at thefocal region 18 b, such that other regions are not significantly heatedor affected by the targeted or directed or focused energy, heatingdevice 10 may be operable to provide energy and heat from either side ofthe glass sheet without substantially or excessively heating the glasssheet or the electrical connector.

[0039] During operation, heating device 10 is moved relative to theglass sheet 12 such that the solder layer 26 of electrical connector 14is positioned generally at second focal region 18 b. The lamp 16 isactivated and the focused or directed energy generates a hightemperature at focal region 18 b to melt the solder layer 26 atconnector 14. The protrusions 14 c at base portion 14 a of connector 14maintain the appropriate space or gap between base portion 14 a andsilver conductive layer or element 24 a while the solder is in itsmolten state. After the solder is melted by heating device 10, heatingdevice 10 is moved away from connector 14 and/or lamp 16 is deactivated,and the solder 26 is allowed to cool and refreeze to secure connector 14to the conductive element 24 a of the glass sheet 12. The electricalconnector 14 may be held or secured in the appropriate position duringthe heating and cooling processes until the solder sufficiently coolsand hardens to sufficiently retain or bond the electrical connector tothe conductive element of the glass sheet.

[0040] Referring now to FIG. 6, an infrared radiative heating device 110comprises a radiation heating device which radiates energy to a targetor focal region and includes an infrared lamp or radiative heat source116 positioned within a reflector 118. Lamp 116 may comprise any type ofinfrared lamp or radiative source, such as a high intensity, quartzinfrared lamp or heat source, or an infrared bulb or lamp such as an EVD36 volt, 400 watt lamp commercially available from Wiko Ltd. of OrlandPark, Ill., without affecting the scope of the present invention.Infrared lamp 116 may comprise a tubular quartz, short wave infraredlamp or may comprise a long wave infrared lamp, depending on theapplication of the heating device. Preferably, at least some, andpreferably a considerable portion, of the energy radiated from theselected lamp or radiative source is at or within the near-infrared orinfrared region of the energy spectrum, such as approximately 800-1500nm, more preferably approximately 1000-1300 nm, and most preferablyapproximately 1100-1200 nm.

[0041] In the illustrated embodiment of FIG. 6, reflector 118 comprisesa shaped reflector having a generally cylindrical body portion whichtapers or narrows to a truncated nozzle end 118 a. The interior surfaceof reflector 118 preferably comprise a polished metallic surface whichmay be polished to a specular or mirrored finish. Reflector 118 maycomprise a metallic material, such as aluminum or steel or the like, andis truncated at one end such that the connector 14 may be positioned ator outside of the truncated end of the reflector 118 for receiving theheat that is generated by the lamp 116 and funneled or channeled orotherwise directed generally at the truncated end 118 a, as discussedbelow. Reflector 118 may comprise a two piece reflector having with anozzle or funnel piece 118 b which is truncated and a lamp mountingpiece 118 c for removably mounting the lamp 116. The lamp mounting piece118 c is mountable or securable to nozzle piece 118 b at the endopposite the nozzle end 118 a. Lamp mounting piece 118 c may comprise agenerally conical-shaped, polished interior surface to direct the energygenerated from lamp 116 generally toward nozzle end 118 a of reflector118.

[0042] Infrared radiative lamp 116 is positioned within reflector 118 ascan be seen in FIG. 6. Because reflector 118 comprises a nozzle-shapedor funnel-shaped reflector, the energy generated and radiated frominfrared lamp 116 within reflector 118 will be directed or focused ortargeted to maximize the energy, and thus generate heat, at the nozzleend 118 a. Heating device 110 thus provides localized heat only to adesired area and the heat source or lamp does not come in contact withthe connector 14 or the glass sheet 12 during the heating process,discussed below. For example, the distance between the lamp 116 and thesolder layer 26 or connector base 14 a may be approximately 0.5-1.5inches during the heating process. In the illustrated embodiment,heating device 110 may generate a temperature of approximately 500degrees F. or greater within a short period of time at nozzle end 118 a.The temperatures and energy or heat rates achieved may vary depending onthe shape of reflector 118, the type of lamp 116 and the size andmaterial of the connector 14, without affecting the scope of the presentinvention. The energy output of the heating device may be adjusted tomatch the process requirements.

[0043] Referring now to FIGS. 7 and 8, a connector holder and/or shield130 may be provided or positioned at nozzle end 118 a of reflector 118to temporarily hold the connector 14 in place at the glass sheet duringthe heating or soldering process, as discussed below. Holder 130comprises a mounting portion 132, a shield portion 134 and a pivotableshield portion 136. Mounting portion 132 may be mountable to a movablearm or member or support structure (not shown) at the window assemblyplant line for moving holder 130 toward and away from heating device 110and/or glass sheet 12 during the assembly and heating and coolingprocess, as also discussed below. As can be seen with reference to FIGS.7 and 8, pivotable shield portion 136 is pivoted about a pivot axis 138at shield portion 134 between an upward position, where pivotable shieldportion 136 and shield portion 134 define a connector holding space 135and function to generally hold or retain connector 14 for positioningconnector 14 at heating device 110 and/or glass sheet 12, and a downwardor releasing position, where holder 130 may release the connector 14 asholder 130 is moved away or lifted upward from the glass sheet 12 afterthe heating or soldering process is completed, as discussed below.

[0044] Referring now to FIGS. 9-11, the process of heating and solderingthe connector 14 to the glass sheet 12 begins with the connector 14being placed generally within the connector holding space 135 ofconnector holder 130, such as by being manually placed within theholding space while the connector is separated from the heating device110 and glass sheet 12, such as shown generally in FIG. 7. The connectorholder 130 and connector 14 are positioned at the glass sheet withheating device 110 being positioned generally adjacent to connectorholder 130, such that connector 14 is generally positioned at nozzle end118 a of reflector 118, with connector portion 14 b extending partiallywithin reflector 118, as shown in FIG. 9. For example, connector 14 andconnector holder 130 may be moved to the nozzle end 118 a of reflector118 and secured in an appropriate position with respect to reflector118, and the heating device 110 and connector holder 130 and connector14 may be moved as a unit onto the surface of the glass sheet 12.Alternately, connector 14 and connector holder 130 may be moved to thesurface of the glass sheet and the heating device 110 may be moved tothe connector and holder at the glass sheet, without affecting the scopeof the present invention. Shield portion 134 and pivotable shieldportion 136 generally surround connector 14 at nozzle end 118 a ofreflector 118 and are positioned between reflector 118 and glass sheet12.

[0045] When heating device 110 is positioned at connector holder 130 andglass sheet 12, lamp 116 of heating device is actuated and generatesradiation energy which is funneled or channeled or otherwise directed toconnector 14 at glass sheet 12 by reflector 118. The heat is provided tothe target area at the nozzle end 118 a of reflector 118 and is shieldedfrom reaching or substantially heating other areas surrounding thetarget area by shield portion 134 and pivotable shield portion 136 ofholder or shield member 130. Accordingly, substantial heat is generatedat connector 14 and/or solder layer 26, while a substantially reducedamount of heat may be directed to or may dissipate to or may reach glasssheet 12 surrounding connector 14. In a preferred embodiment, heatingdevice 110 may rapidly generate and channel or direct heat at connector14 at a temperature of greater than approximately 500 degrees F., andmore preferably greater than approximately 540 degrees F., and mostpreferably greater than approximately 570 degrees F., such as forpreferably approximately five to eight seconds, to melt the solder layerat connector 14. For example, the heating device may rapidly generateand direct the energy at the solder joint to be formed for less thanapproximately 20 seconds, more preferably less than approximately 15seconds, and most preferably less than approximately 10 seconds. While asubstantial amount of heat is thus rapidly applied to the target area,the holder 130 shields the heat or radiation from being directed to andfrom reaching other areas, such that the temperature of the glass sheetat and around the connector 14 is preferably not heated aboveapproximately 175 degrees F., more preferably not heated aboveapproximately 160 degrees F., more preferably not heated aboveapproximately 135 degrees F., and most preferably not heated aboveapproximately 115 degrees F.

[0046] After the solder layer is melted by heating device 110, heatingdevice 110 may be deactivated and/or withdrawn from holder 130 andconnector 14 and glass sheet 12, as shown in FIG. 10. Solder layer 26may then cool and refreeze or harden to secure connector 14 to glasssheet 12. To shorten the cooling process, a fan or blower or coolingdevice 140 may be provided to blow on or increase air circulation aroundthe connector and solder layer to cool and harden the solder layer in ashorter period of time. For example, cooling device 140 may blow ordirect air at approximately 15 p.s.i. or lower to approximately 40p.s.i. or greater at connector 14 and/or the solder joint for preferablyless than approximately twelve seconds, more preferably less thanapproximately eight seconds, and most preferably less than approximatelyfive seconds, to cool and harden the solder layer at connector 14 andglass sheet 12.

[0047] After the solder layer has cooled and hardened to secureconnector 14 to glass sheet 12, such as to a conductive layer or thelike on glass sheet 12 or directly to the surface of the glass sheet,connector holder 130 may be removed from the glass sheet 12, such as bylifting the holder 130 in a direction generally normal to and away fromthe surface of the glass sheet. As shown in FIG. 11, pivotable shieldportion 136 may pivot downward to the releasing position as holder 130is moved from connector 14 and glass sheet 12, to allow the holder 130to release the connector from the connector holding space 135. A pulltest may be performed on the soldered connector to ensure a secureattachment of the connector to the glass sheet. Pull tests have shownthat the connector 14 may be secured on the glass sheet via the abovedescribed process such that the connector may withstand approximately500 p.s.i. to approximately 1000 p.s.i. of pull pressure at theconnector. Glass sheet 12, with connector 14 secured thereon, may bemoved to the next assembly process, while a new connector is positionedin holder 130 and the process is repeated on the next glass sheet.

[0048] The connector application process of the present invention thusmay rapidly attach an electrical connector to a glass sheet, preferablyin less than approximately one minute, more preferably in less thanapproximately 45 seconds and most preferably in less than approximately30 seconds. In a particular embodiment of the application process of thepresent invention, an electrical connector may be attached to a glasssheet and tested within approximately 30 seconds. More particularly, theglass sheet may be transferred or moved to the attachment station withinapproximately five seconds and the window element or electricalconnector may be loaded to the holding device and the heating device andthe holding device may be loaded or positioned at the glass sheet withinapproximately five seconds. The heating device may then be actuated torapidly heat the connector and/or solder layer for approximately eightseconds, after which the connector and solder joint may cool forapproximately three to five seconds. A pull test or the like may then beconducted on the connector which may take approximately three seconds.The glass sheet may then be transferred or moved out of the connectorattachment station and toward the next station in approximately fourseconds. The entire attachment process of a typical embodiment of thepresent invention thus may take approximately 30 seconds to complete.

[0049] The rapid heat and melt time provided by the heating device 110thus may result in the completion of the attachment of the connector tothe glass sheet in less than approximately thirty to forty seconds.Also, the heating process heats the connector rapidly, whilesubstantially limiting directing of heat toward or into the glass sheet.The present invention thus facilitates attachment of the connectorwithin a short period of time and limits or substantially precludesdamage to the glass sheet which may occur if the glass sheet is rapidlyheated or overheated, as may occur during some conventional processes.The present invention thus facilitates attaching the connector or otherwindow element or component or hardware to a glass sheet along thewindow assembly line at a modular window assembly plant.

[0050] Because the heating device of the present invention may comprisea relatively low cost device and requires little plant space to use andmay rapidly solder the connector or window element to the glass sheetwhile substantially limiting directing of or dissipation of the energytoward or to the glass sheet, it is envisioned that the heating devicemay be implemented at a modular window assembly plant where the frame,seals, hinges and/or the like are attached to the glass sheet, insteadof at the glass manufacturing or fabrication plant, where glass sheetsare formed or fabricated and where electrical connectors are typicallyattached to glass sheets. As shown in FIG. 12, a manufacturing andassembly process 200 for manufacturing a modular window assembly inaccordance with the present invention may include manufacturing atempered glass sheet (or other type of glass sheet, such as an annealedglass sheet or a laminated glass sheet or the like) at 210 andinspecting and packing the glass sheets at 220 at a glass fabrication ormanufacturing plant. The tempered glass sheets may be packed in a highdensity manner since they do not include any connectors or frames orseals or the like extending therefrom. The packed glass sheets are thenshipped to a vehicular or modular window assembly plant at 230.

[0051] The modular window assembly plant receives connectors or clips at240 and other window hardware (such as hinges, frames, seals and/or thelike) at 250. The modular window assembly plant also receives the glasssheets from the glass manufacturing plant at 260 and unpacks the glasssheets at 270. The connectors are soldered to the sheets in the mannerdescribed above and the hardware is assembled onto the glass sheet at280. The modular window assembly plant then inspects and packs theassembled vehicular or modular window assemblies in a low density mannerat 290 for shipment or transport to the vehicle assembly plant orfacility.

[0052] The present invention thus allows the glass manufacturing plantor glass fabrication plant to pack the glass sheets in a high densitymanner one time and to ship the densely packaged glass sheets to themodular window assembly plant. This avoids the extra packing andunpacking step of the conventional processes, such as the conventionalprocess shown in FIG. 1, and allows a greater number of glass sheets tobe shipped in a container to the modular window assembly plant. Thedensely packaged glass sheets may then be unpacked at the modular windowassembly plant and assembled to the completed modular window assemblyforms. The completed modular window assemblies may then be packed in alow density manner for shipment to the automotive vehicle assemblyplant.

[0053] Therefore, the present invention provides a low cost, efficientdevice and method and system for attaching or soldering an electricalconnector to a conductive element of a glass sheet of a vehicle window.The radiation heating device of the present invention provides localizedenergy and heat to a desired and targeted area corresponding to a solderlayer between the electrical connector and the glass sheet, and may notsubstantially or excessively heat other portions of the product, such asthe glass sheet generally surrounding the connector. The heating devicemay substantially and rapidly heat the connector and/or solder layer,while substantially limiting directing of heat toward or into the glasssheet. Also, the present invention provides a non-contacting heat sourceor lamp which does not contact the electrical connector or glass sheetduring the heating and soldering process.

[0054] Additionally, because of the rapid heating time of the solderlayer by the heating device and the substantially reduced heating of theglass sheet during the heating process, the radiation heating device ofthe present invention may be implemented at a glass or windowmanufacturing plant or at a vehicular or modular window assembly plant.By implementing the heating device of the present invention at thevehicular or modular window assembly plant, the present inventionenhances the efficiency of the window manufacturing and assemblyprocesses, thereby reducing the overall costs of the window assembly.

[0055] Changes and modifications in the specifically describedembodiments can be carried out without departing from the principles ofthe present invention, which is intended to be limited only by the scopeof the appended claims, as interpreted according to the principles ofpatent law.

The embodiments of the invention in which an exclusive property orprivilege is claimed are defined as follows:
 1. A method for applying anelectrical connector to a conductive element disposed on a surface of aglass sheet of a window, said method comprising: providing a glass sheethaving a conductive element disposed on a surface thereof; providing aninfrared radiative heating device comprising an infrared lamp and areflector configured to direct radiant energy generated by said lamp ata target region; positioning an electrical connector at said conductiveelement of said glass sheet; positioning said heating device relative tosaid glass sheet such that said target region corresponds generally withthe location of a solder layer between said electrical connector andsaid conductive element of said glass sheet; and attaching saidelectrical connector to said conductive element via radiation heating ofsaid solder layer with said infrared radiative heating device.
 2. Themethod of claim 1, wherein attaching said electrical connector to saidconductive element comprises attaching said electrical connector to saidconductive element via radiation heating of a layer of solder applied toa surface of said electrical connector.
 3. The method of claim 1,wherein providing an infrared radiative heating device comprisesproviding an infrared radiative heating device comprising an infraredlamp and a shaped reflector configured to direct radiant energygenerated by said lamp at a target region.
 4. The method of claim 3,wherein said shaped reflector comprises one of a parabolic-shapedreflector, an ellipsoid-shaped reflector and a nozzle-shaped reflector.5. The method of claim 3, wherein said shaped reflector defines firstand second focal points, said infrared lamp being positioned generallyat said first focal point and said target region being generally at saidsecond focal point.
 6. The method of claim 3, wherein said shapedreflector comprises a truncated shaped reflector.
 7. The method of claim6, wherein said infrared lamp is positioned at an interior of saidtruncated shaped reflector and said target region is positioned at anexterior of said truncated shaped reflector.
 8. The method of claim 3,wherein said shaped reflector comprises a metallic material having apolished interior surface.
 9. The method of claim 1 including limitingdirecting of heat to said glass sheet during said radiation heating ofsaid solder layer.
 10. The method of claim 9 including providing ashield generally surrounding said connector at said glass sheet forlimiting directing of heat to said glass sheet.
 11. The method of claim10, wherein said shield functions to temporarily hold said connector atsaid glass sheet during said radiation heating.
 12. The method of claim11, wherein said shield includes a pivotable shield portion which pivotsto release said shield from said connector after said radiation heatingof said solder layer.
 13. The method of claim 1, wherein positioning anelectrical connector comprises positioning an electrical connector andsaid solder layer at a first surface of said glass sheet, and whereinpositioning said heating device comprises positioning said heatingdevice adjacent to a second surface of said glass sheet, said secondsurface being generally opposite said first surface.
 14. The method ofclaim 13, wherein said heating device is operable to radiate energythrough said glass sheet to said focal region at said first surface ofsaid glass sheet.
 15. The method of claim 14, wherein said glass sheetsubstantially transmits said infrared radiation and said solder layersubstantially absorbs said infrared radiation.
 16. The method of claim14, wherein said infrared lamp is operable to generate infraredradiation having a wavelength of less than approximately 1200 nm. 17.The method of claim 1, wherein said infrared lamp is operable togenerate infrared radiation having a wavelength of less thanapproximately 1200 nm.
 18. The method of claim 1, wherein providing aglass sheet comprises providing a glass sheet at a modular windowassembly plant.
 19. An attachment system for soldering an electricalconnector to a glass sheet comprising: a heating device, said heatingdevice comprising an infrared radiative heat source positioned at leastpartially within a shaped reflector, said shaped reflector being shapedto direct infrared radiant energy from said lamp at a target region; anda holding device for temporarily holding the electrical connector, saidheating device and said holding device being arrangable relative to oneanother and relative to the glass sheet such that said holding deviceand the electrical connector are positionable generally at a surface ofthe glass sheet and said heating device is positionable generally atsaid holding device with a solder layer being generally at said targetregion, said heating device being operable to generate and direct saidinfrared radiative energy at said target region to heat and melt thesolder layer while said holding device holds the electrical connectorand substantially limits directing of said infrared radiant energy tothe glass sheet.
 20. The attachment system of claim 19, wherein saidshaped reflector comprises one of a parabolic-shaped reflector, anellipsoid-shaped reflector and a nozzle-shaped reflector.
 21. Theattachment system of claim 19, wherein said shaped reflector comprises apolished metallic interior surface for reflecting and directing saidinfrared radiant energy at said target region.
 22. The attachment systemof claim 19, wherein said holding device comprises a base portion and apivotable portion which is pivotable relative to said base portion. 23.The attachment system of claim 22, wherein said holding device isremovable from the electrical connector and the glass sheet after theelectrical connector is secured to the glass sheet, said pivotableportion being pivotable relative to said base portion to release theelectrical connector as said holding device is moved from the electricalconnector and the glass sheet.
 24. The attachment system of claim 22,wherein said base portion and said pivotable portion generally surroundthe electrical connector and substantially limit directing of saidinfrared radiative energy around the electrical connector to the glasssheet.
 25. The attachment system of claim 19, wherein said holdingdevice generally surrounds the electrical connector and substantiallylimits directing of said infrared radiative energy around the electricalconnector to the glass sheet.
 26. A method for manufacturing andassembling a window assembly comprising: providing a glass sheet;providing an infrared radiative heating device comprising an infraredlamp and a shaped reflector configured to direct radiant energy fromsaid lamp at a target region; positioning a window element in a holder;positioning said holder and said window element generally at said glasssheet; positioning said heating device relative to said holder such thatsaid target region corresponds generally with the location of a layer ofsolder at one of said window element and said glass sheet; heating saidsolder layer via radiation heating of said solder layer with saidinfrared radiative heating device; and substantially limiting directingof said heat to said glass sheet via said holder.
 27. The method ofclaim 26 including applying a conductive element on a surface of saidglass sheet, wherein positioning said holder and said window elementgenerally at said glass sheet comprises positioning said holder and saidwindow element generally at said conductive element, said solder layerbeing at one of said window element and said conductive element.
 28. Themethod of claim 27, wherein positioning a window element in a holdercomprises positioning an electrical connector in a holder.
 29. Themethod of claim 26 including: fabricating a glass sheet at a glass sheetfabrication plant; and transporting said glass sheet from said glasssheet fabrication plant to a modular window assembly plant remote fromsaid glass sheet fabrication plant.
 30. The method of claim 29, whereinproviding an infrared radiative heating device comprises providing aninfrared radiative heating device at said modular window assembly plantremote from said glass sheet fabrication plant.
 31. The method of claim30 including assembling at least one of a seal, a hinge and a frame tosaid glass sheet at said modular window assembly plant.
 32. The methodof claim 26 including at least one of deactivating said infraredradiative heating device and removing said infrared radiative heatingdevice from said holder and said glass sheet after heating said solderlayer.
 33. The method of claim 32 including cooling said solder layerafter heating said solder layer.
 34. The method of claim 33 includingremoving said holder from said window element after cooling said solderlayer.
 35. The method of claim 34, wherein removing said holdercomprises pivoting a portion of said holder relative to another portionof said holder to release said holder from said window element.
 36. Themethod of claim 26, wherein said infrared lamp is positioned at aninterior of said shaped reflector and said target region is positionedat an exterior of said shaped reflector.
 37. The method of claim 26,wherein said shaped reflector comprises a metallic material having apolished interior surface.
 38. The method of claim 26, wherein saidshaped reflector comprises one of a parabolic-shaped reflector, anellipsoid-shaped reflector and a nozzle-shaped reflector.
 39. The methodof claim 26, wherein said shaped reflector comprises a truncated shapedreflector having an open end.
 40. The method of claim 39, wherein saidlamp is positioned generally within said truncated shaped reflector andsaid target region is positioned generally outside of said truncatedshaped reflector and generally at said open end.